ND1130 Series
Dual H-Bridge Driver with Boost converter

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Description

The ND1130 is a dual H-bridge driver IC that uses a Bi-CMOS process with Boost converter. The boost voltage from a Li-ion battery or 5V power supply, and drive small piezoelectric actuators and haptic devices using two H-bridge drivers. The Boost converter has a built-in soft-start function to limit the inrush current at power-on. The dual H-bridge driver supports independent signal input between channels, improving controllability from the microcontroller. I/O signal freguencyis up to 300 kHz and can output a FAULT signal in the event of an error.

Applications

  • Small piezo actuators
  • Haptics devices

Spec

Standard
Channels 4(Half)
Switching Current Min. 1.5A(Boost)
Output Rise/Fall Time Typ. 400nsec / 340nsec
Structure Bi-CMOS
Wide Operating Temperature -40℃ to +105℃
Junction Temp. +150℃
Package WLCSP-30-ZA1
Boost converter Block Operating Voltage 2.7V to 5.5V
Oscillation Frequency 380kHz to 1MHz
PWM Control
H-Bridge Driver Block Operating Voltage 7.0V to 35V
Input Frequency 300kHz (max.)
Internal 2-Channel H-Bridge Driver
Note Standby Function
Under Voltage Lockout
Built-in Thermal Shutdown
Fault Indicator Output

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Protections / Functions

UVLO OCP TSD Reverse

Functional Description

UVLO Undervoltage Lockout Protection
OCP Overcurrent Protection
TSD Thermal Shutdown Function
Reverse Current Protection Reverse Current Protection

Functional Description

UVLO Undervoltage Lockout Protection
OCP Overcurrent Protection
TSD Thermal Shutdown Function
Reverse Current Protection Reverse Current Protection

Search for similar products under conditions below.

Category:Switching Drivers

Sub Ctegory Boost Converter
No.of Circuit 4
Drive Circuit Half
Supply Voltage
min(V)
2.7
Supply Voltage
max(V)
5.5
Switching Current
(Boost)
min (A)
1.5

Technical Documents

Quality & Packages

  • Refer to the datasheets for the details on the product.
  • The package file or the datasheet includes package dimensions, taping specifications, taping reels dimensions, power dissipations, and recommended land pattern.

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