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Japan-Based Foundry with Strengths in
Analog, High-Speed, and High-Voltage Technologies Foundry Services

Manufacturing in Japan for
Long-Term Supply Stability and High Quality

Bipolar / BiCMOS / CMOS

Nisshinbo Micro Devices specializes in mature process technologies for analog and power semiconductors, providing integrated manufacturing services from wafer fabrication through testing and packaging. With 5-, 6-, and 8-inch production lines in Japan, we ensure a stable supply from prototyping to high-volume manufacturing.

Supporting Your Semiconductor Development
with Proven Technical Expertise

Semiconductor success depends not only on performance, but also on advanced design and manufacturing capabilities. Leveraging our mature process technologies, we provide highly reliable and precise manufacturing in Japan, supporting our customers’ product development from a technical perspective.

Benefit 4

Proven Track Record Across Diverse Applications

  • Analog ICs

    Analog ICs

  • High-Voltage Devices

    High-Voltage Devices

  • Power Management ICs

    Power Management ICs

  • RF Devices (GaAs / SAW)

    RF Devices
    (GaAs / SAW)

  • Sensors (Optical, Acoustic, etc.)

    Sensors
    (Optical, Acoustic, etc.)

Benefit 1
High-Reliability and High-Precision Process Technologies

Through SPICE modeling and process variation control, we help achieve stable quality and device characteristics from design through mass production, contributing to our customers' long-term stable manufacturing.

Supporting Long-Term Stable Production Through Reliable Operation

  • Strong Correlation Between Design and Measured Results

    Strong Correlation Between Design and Measured Results

  • Stable Mass Production Performance

    Stable Mass Production Performance

  • Design Focused on Quality and Reproducibility

    Design Focused on Quality and Reproducibility

Available EDA Tools

Item Vendor Product Name Remarks
Schematic editor Cadence Virtuoso Schematic OpenAccess
Synopsys Custom Compiler Schematic OpenAccess
Silvaco Gateway
Circuit simulator Cadence Virtuoso Spectre
Synopsys HSPICE
Silvaco SmartSpice
Layout editor Cadence Virtuoso Layout No PCell
Synopsys Custom Compiler Layout
Layout verification Siemens (Mentor) Calibre Signoff verification

Availability may vary depending on process technology.

Benefit 2
Customization and Technical Support

We provide technical proposals tailored to customer requirements and challenges, supporting projects from design optimization to mass production.

Development Flow

  • Inquiry

    Inquiry

  • NDA Agreement

    NDA Agreement

  • Technical Review (PDK Definition)

    Technical Review (PDK Definition)

  • Quotation

    Quotation

  • Design and Mask Fabrication

    Design & Mask Fabrication

  • Prototype Evaluation and Mass Production

    Prototype Evaluation & Mass Production

Benefit 3
Integrated End-to-End Manufacturing in Japan

With integrated manufacturing operations in Japan and extensive 5-, 6-, and 8-inch production capabilities, we support stable supply, small-volume production, and fab transfer projects, enabling long-term stable production for our customers.

Wafer Fabrication Facilities

Kawagoe Plant

Process Wafer Size Major Applications Process Technology
Silicon 5-inch Analog ICs, RF Devices, Sensors 0.7 µm and larger
GaAs  4-inch RF Switches, LNA, FEM 0.3 µm and larger
SAW  4-inch SAW Filters, SAW Sensors 0.4 µm and larger
Kawagoe

Yashiro Plant

Silicon, Wafer Size Major Applications Process Technology
6-inch Power ICs, Power Devices, Image Sensors 0.5 μm and larger
8-inch Power ICs, Image Sensors 0.18 μm and larger
Yashiro

Nisshinbo Micro Devices Fukuoka Co., Ltd.

Silicon, Wafer Size Major Applications Process Technology
5-inch Analog ICs, Power ICs, Protection Devices 0.8 μm and larger
6-inch Analog ICs, Power ICs, Protection Devices, Sensors 2.0 μm and larger
Fukuoka

Assembly & Packaging Facilities

Nisshinbo Micro Devices AT Co., Ltd.

We provide optimal semiconductor packaging through a broad package lineup and proprietary technologies.

  • Examples:
    SOP, SSOP, QFP, LQFP, HTSSOP, VSP/TVSP, ESON/EQFN, PMAP
  • COMUOON Assistive Listening Speaker
AT

Nisshinbo Micro Devices (Thailand) Co., Ltd.

We achieve both high quality and cost efficiency through a diverse semiconductor packaging lineup.

  • Examples:
    DIP, DMP, SSOP, VSP, TO-252, SOT-89, SOT-23
  • Microwave Product Packaging
Thailand

Benefit 4
Process Technologies Supporting Analog and High-Voltage Applications

We offer a broad portfolio of production-proven processes ranging from high-voltage analog and BCD to mixed-signal and digital technologies. Supporting a wide range of voltage requirements and design rules, we help customers select the optimal process for their specifications, providing seamless support from prototyping to mass production and long-term supply.

Supporting a Wide Range of Voltage and Scaling Requirements

  • Kawagoe 5 inch
  • Fukuoka 5 or 6 inch
  • Yashiro 6 or 8 inch
  • UMC 8 inch
  • Broad Process Coverage
    • Voltage Range: 1.8 V to 80 V
    • Minimum Design Rule:
      0.18 μm and larger
  • Extensive Manufacturing Network
    • Stable supply through our facilities in Japan (Kawagoe, Fukuoka, and Yashiro) and UMC.
  • PDK-Supported Processes*
    • Comprehensive Design Environment Support