Japan-Based Foundry with Strengths in
Analog, High-Speed, and High-Voltage Technologies Foundry Services
Analog, High-Speed, and High-Voltage Technologies Foundry Services
Manufacturing in Japan for
Long-Term Supply Stability and High Quality
Bipolar / BiCMOS / CMOS
Nisshinbo Micro Devices specializes in mature process technologies for analog and power semiconductors, providing integrated manufacturing services from wafer fabrication through testing and packaging. With 5-, 6-, and 8-inch production lines in Japan, we ensure a stable supply from prototyping to high-volume manufacturing.
Supporting Your Semiconductor Development
with Proven Technical Expertise
Semiconductor success depends not only on performance, but also on advanced design and manufacturing capabilities. Leveraging our mature process technologies, we provide highly reliable and precise manufacturing in Japan, supporting our customers’ product development from a technical perspective.
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Benefit 1
Enabling Long-Term
Stable Mass Production
High-Reliability and High-Precision Process Technologies
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Benefit 2
Supporting Customers from Development to Mass Production
Customization and
Technical Support -
Benefit 3
Flexible Support for
Small-Volume Production
Stable Supply Through Manufacturing in Japan
Benefit 4
Proven Track Record Across Diverse Applications
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Analog ICs
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High-Voltage Devices
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Power Management ICs
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RF Devices
(GaAs / SAW) -
Sensors
(Optical, Acoustic, etc.)
Benefit 1
High-Reliability and High-Precision Process Technologies
Through SPICE modeling and process variation control, we help achieve stable quality and device characteristics from design through mass production, contributing to our customers' long-term stable manufacturing.
Supporting Long-Term Stable Production Through Reliable Operation
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Strong Correlation Between Design and Measured Results
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Stable Mass Production Performance
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Design Focused on Quality and Reproducibility
Available EDA Tools
| Item | Vendor | Product Name | Remarks |
|---|---|---|---|
| Schematic editor | Cadence | Virtuoso Schematic | OpenAccess |
| Synopsys | Custom Compiler Schematic | OpenAccess | |
| Silvaco | Gateway | ||
| Circuit simulator | Cadence | Virtuoso Spectre | |
| Synopsys | HSPICE | ||
| Silvaco | SmartSpice | ||
| Layout editor | Cadence | Virtuoso Layout | No PCell |
| Synopsys | Custom Compiler Layout | ||
| Layout verification | Siemens (Mentor) | Calibre | Signoff verification |
Availability may vary depending on process technology.
Benefit 2
Customization and Technical Support
We provide technical proposals tailored to customer requirements and challenges, supporting projects from design optimization to mass production.
Development Flow
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Inquiry
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NDA Agreement
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Technical Review (PDK Definition)
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Quotation
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Design & Mask Fabrication
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Prototype Evaluation & Mass Production
Benefit 3
Integrated End-to-End Manufacturing in Japan
With integrated manufacturing operations in Japan and extensive 5-, 6-, and 8-inch production capabilities, we support stable supply, small-volume production, and fab transfer projects, enabling long-term stable production for our customers.
Wafer Fabrication Facilities
Kawagoe Plant
| Process | Wafer Size | Major Applications | Process Technology |
| Silicon | 5-inch | Analog ICs, RF Devices, Sensors | 0.7 µm and larger |
| GaAs | 4-inch | RF Switches, LNA, FEM | 0.3 µm and larger |
| SAW | 4-inch | SAW Filters, SAW Sensors | 0.4 µm and larger |
Yashiro Plant
| Silicon, Wafer Size | Major Applications | Process Technology |
| 6-inch | Power ICs, Power Devices, Image Sensors | 0.5 μm and larger |
| 8-inch | Power ICs, Image Sensors | 0.18 μm and larger |
Nisshinbo Micro Devices Fukuoka Co., Ltd.
| Silicon, Wafer Size | Major Applications | Process Technology |
| 5-inch | Analog ICs, Power ICs, Protection Devices | 0.8 μm and larger |
| 6-inch | Analog ICs, Power ICs, Protection Devices, Sensors | 2.0 μm and larger |
Assembly & Packaging Facilities
Nisshinbo Micro Devices AT Co., Ltd.
We provide optimal semiconductor packaging through a broad package lineup and proprietary technologies.
- Examples:
SOP, SSOP, QFP, LQFP, HTSSOP, VSP/TVSP, ESON/EQFN, PMAP - COMUOON Assistive Listening Speaker
Nisshinbo Micro Devices (Thailand) Co., Ltd.
We achieve both high quality and cost efficiency through a diverse semiconductor packaging lineup.
- Examples:
DIP, DMP, SSOP, VSP, TO-252, SOT-89, SOT-23 - Microwave Product Packaging
Benefit 4
Process Technologies Supporting Analog and High-Voltage Applications
We offer a broad portfolio of production-proven processes ranging from high-voltage analog and BCD to mixed-signal and digital technologies. Supporting a wide range of voltage requirements and design rules, we help customers select the optimal process for their specifications, providing seamless support from prototyping to mass production and long-term supply.
Supporting a Wide Range of Voltage and Scaling Requirements
- Kawagoe 5 inch
- Fukuoka 5 or 6 inch
- Yashiro 6 or 8 inch
- UMC 8 inch
- Broad Process Coverage
- Voltage Range: 1.8 V to 80 V
- Minimum Design Rule:
0.18 μm and larger
- Extensive Manufacturing Network
- Stable supply through our facilities in Japan (Kawagoe, Fukuoka, and Yashiro) and UMC.
- PDK-Supported Processes*
- Comprehensive Design Environment Support
Contact Us
Nisshinbo Micro Devices is a semiconductor foundry in Japan delivering high reliability and long-term supply through mature process technologies. Our process, CAD, and design engineers work directly with customers as needed to understand requirements and provide optimal technical information and support.






