Package support information

Soldering

This section provides information necessary for using semiconductor devices, including storage and cleaning conditions related to device mounting on a substrate, as well as reflow profiles. Please use it together with the product data sheet.

Soldering flux

Don’t use halogen-based soldering flux.
Please use RMA type and low residue type.

Heat-resistance profiles

MSL（Moisture Sensitivity Levels）

Our products are classified as follows. Though reflow process can be allowed up to 3 times, make sure to minimize the temperature and the exposure time.( Some products are limited up to 2 times.)

(*) Baking: 125°C, 24 h

The board cleaning conditions.

1. Cleaning Conditions （Electronic device products）
   • We recommend alternative CFCs substitute for solvent.
     Don’t use trichloroethylene, trichloroethane, etc.
   • Cleaning time should be less than 180 s. (including in solvent, in vapor and in ultrasonic bath).
   • Ultrasonic cleaning is available
     Frequency : 28 to 40 kHz (Please avoid resonance.)
     Power : 15 W/liter (MAX.)
     Time : 60 s (MAX.)
   
   

   (Note)The above cleaning conditions are just reference. Please confirm the following items too.

   • Set the proper cleaning condition according to the recommendation of the cleaner manufacturer.
   • Take notice that mark legibility can be degraded by cleaning.
   • Please be careful not to remain corrosive constituents.
2. Cleaning Conditions (Optoe-Electronic Devices)
   • Please refrain from cleaning of the device as much as possible.
     Be careful to a void solvents or the vapor of solvents attach the resin of devices even during the mounting and using.
   • If cleaning flux and others is indispensable, lead parts of devices only can be cleaned by using the following solvent by the condition within 35℃ and 3minute.
       Solvent : isopropyl alcohol, methyl alcohol
   • For products that support reflow soldering, avoid cleaning immediately after the reflow.

Storage Condition

Notes of IC storage

1. Do not use water for the tap for humidifiers, but use pure water or boiled water.
2. Do not store devices in a corrosive-gas atmosphere.
3. Do not store devices in a dusty place.
4. Do not expose devices to direct sunlight.
5. Maintain the temperature of the storage place stabilized.
6. Keep away from excessive load and impact.
7. Keep away from excessive electromagnetic radiation exposure.

Storage period

Please mount devices within a year after delivering. For the devices have stored longer than a year, check the corrosion of leads and solderability before using.

IC Storage Conditions for Normal Packing

1. Temperature and humidity ranges.
   Temperature: 5 to 30 (℃)
   Humidity : 30 to 85 (%)
   • Baking is unnecessary in the above mentioned storage conditions.
2. Moisture Sensitivity Levels
   JEDEC: Level 1

IC Storage Conditions for Deaeration Packing

1. Temperature and humidity ranges.
   Temperature before unpacking: 5 to 40 (℃)
   Humidity : 30 to 90 (%)
   Temperature after unpacking: 5 to 30 (℃)
   Humidity : 30 to 60 (%)
   Use devices within 4weeks (672h) after unpacking.
   • Baking is unnecessary in the above mentioned storage conditions.
2. Moisture Sensitivity Levels
   JEDEC: Level 2a

IC Storage Conditions for Moisture-Proof Packing

1. Temperature and humidity ranges.
   Temperature before unpacking: 5 to 40 (℃)
   Humidity : 30 to 90 (%)
   Temperature after unpacking: 5 to 30 (℃)
   Humidity : 30 to 60 (%)
   Be sure to use within 1weeks (168h) after the open the anti-humidity seal.
2. Baking
   If deviate from the above condition, be sure to apply baking. (Heat proof tray products)
   Baking ConditionMethod: Ta=125ºC, more thanover 24h
3. Moisture Sensitivity Levels
   JEDEC: Level 3

FAQ

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