Thermal Design Support

Increasing integration and miniaturization of electronic components make thermal design critical. Nisshinbo Micro Devices receives many inquiries about thermal resistance from customers.

In order to respond to customer's request, Nisshinbo Micro Devices started "Thermal design support" that provides thermal resistance simulation results and thermal resistance data. Please utilize Nisshinbo Micro Devices' thermal design support to analyze thermal characteristics at customer's concept design stage.

Thermal resistance simulation support

We create customer specific thermal models and provide

・High accuracy thermal resistance data

・Visualization data of heat conduction path in components and boards and heat flux in ambient air

Nisshinbo Micro Devices uses electronics thermal analysis software FloTHERM® (Mentor Graphics) to create a thermal model.

At the design stage of the board, thermal simulation under various conditions such as board size and number of wiring layers can be performed, which can contribute to reduction of design man-hour and development cost.
Also, by matching with the structure function measured by the transient temperature measurement system T3Ster®, high accuracy simulation can be done.

Screen of electronics thermal analysis software FloTHERM®

Simulation examples

Simulation with different board dimensions

We can simulate thermal resistance by changing the dimensions of the customer's board.
Thermal resistance is highly dependent on board dimensions, board structure and so on.

The optimal thermal resistance can be studied from simulation.
Simulation with different board dimensions

Simulation with different number of wiring layers

Nisshinbo Micro Devices offers thermal resistance of JEDEC-compliant basic 4-layer board, but simulation with different number of wiring layers according to customer's specification is available.

Simulation with different number of wiring layers

Visualization of heat conduction path and heat flux

We provide data in a visualized form such as a heat transfer path diagram, animation of heat flux in ambient air.

Visualization of heat conduction path and heat flux

Model creation screen of electronics thermal analysis software FloTHERM®

By matching with the structure function measured by the transient temperature measurement system T3Ster®, highly accurate simulation can be performed.

Electronics thermal analysis software FloTHERM®: Model creation screen
Adjustment between measured data and simulation result

Adjustment between measured data and simulation result

By matching simulation results to measured data, we create high accuracy models.
By using this model, we can improve the accuracy of simulation according to customer's specifications.

Calculation of thermal resistance

We can calculate the thermal resistance (θja, θjc, ψjt) because the temperature of each part can be known by simulation.

Calculation of thermal resistance

Definition of θja and ψjt

  • θja :Thermal resistance between junction temperature (Tj) and ambient temperature (Ta)
  • ψjt :Thermal resistance between junction temperature (Tj) and package mark surface center temperature (Tc(top))

Definition of θja and ψjt

Thermal resistance measurement support

We measure the thermal resistance value on the customer's actual board and provide
Thermal resistance (θja, θjc, ψjt), Transient thermal characteristic graph and so on.

T3Ster: Transient temperature measurement system

Nisshinbo Micro Devices uses the high accuracy de facto standard transient temperature measurement system T3Ster® (Mentor) to provide measurement results of thermal resistance on customer's actual board or actual board prepared by Nisshinbo Micro Devices.

Transient thermal characteristic graph

We measure transient thermal characteristics on customer's actual board.
The transient thermal characteristic graph shows the thermal resistance of power application time when the customer uses it.

Transient thermal characteristic graph

Measurement principle of transient temperature measurement system T3Ster®

The thermal impedance measured by the transient temperature measurement system T3Ster® is converted into a one-dimensional integral thermal resistance heat capacity network on the thermal conduction path. θja can be calculated from the integral structure function.
Also, θjc can be calculated by measuring samples with different amounts of solder. Furthermore, ψjt can be measured using a thermocouple

Visualize the thermal structure of the device

Visualize the thermal structure of the device
  • Simplified model

    Simplified model

    Integral structure function

  • The measured thermal impedance is converted to a one-dimensional integral thermal resistance heat capacity network on the heat conduction path.

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    Integral structure function

    Structure function graph

For thermal simulation and measurement of thermal resistance using actual board, please contact our sales representative or distributors.