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Reliability Test Specifications (Electronic device products)

  • Nisshinbo Micro Devices Inc.

    We apply the reliability tests to new products, modified products (design, production equipment, process and materials) and process qualification. Reliability tests verify that our products attain the reliability target.

    Reliability Test Specifications

    • 1. Bipolar IC

      IC Storage Conditions for Normal Packing(MSL1)/SMD Type Package

      No. TEST ITEM TEST CONDITION (*)PRE-CONDITION TIME n Reference
      1 High Temp. Operating Life Ta=125℃
      Voltage=Absolute Maximum Rating. Dynamic      		 No 1000h 22 JESD22-A108
      JESD85
      2 High Temp. Storage Life Ta=150℃ No 1000h 22 JESD22-A103
      3 Temp. Cycling Ta=-65 to 150℃ ①＋② 500cycles 22 JESD22-A104
      JESD22-A113
      4-1 HAST Ta=110℃ RH=85%
      Voltage=Absolute Maximum Rating.Static      		 ①＋② 264h 22 JESD22-A110
      JESD22-A113
      4-2 THB Ta=85℃ RH=85%
      Voltage=Absolute Maximum Rating.Static      		 ①＋② 1000h 22 JESD22-A101
      JESD22-A113
      5 UHAST Ta=110℃ RH=85% ①＋② 264h 22 JESD22-A118
      JESD22-A113
      6 Resistance To Soldering Heat 1 Reflow ① 3times 22 JESD22-A113
      J-STD-020
      7 Resistance To Soldering Heat 2 Flow ① 2times 22 JESD22-A111
      J-STD-002
      8 ESD-HBM C=100pF R=1.5k ohm ±2.0kV No Once 3 JS-001
      9 ESD-CDM ±1.0kV No Once 3 JS-002
      10 LU-I ±100mA No Once 3 JESD78
      Criteria：The electrical characteristics prescribed in the individual specifications shall be satisfied.
      • *）

        Pre-Condition

        The test shall be performed this pre-condition before testing.

        The baking condition is 125 ℃ 24h.

        MSL = LEVEL1

        • ①
          Ta=85℃, RH=85%, storage=168h
        • ②
          Reflow soldering heat stress (3times) or Flow soldering heat stress (2times)

        MSL = LEVEL2a

        • ①
          Ta=30℃, RH=60%, storage=696h　or Ta=60℃, RH=60%, storage=120h
        • ②
          Reflow soldering heat stress (3times) or Flow soldering heat stress (2times)

        MSL = LEVEL3

        • ①
          Ta=30℃, RH=60%, storage=192h　or Ta=60℃, RH=60%, storage=40h
        • ②
          Reflow soldering heat stress (3times) or Flow soldering heat stress (2times)
    • 2. CMOS IC,Bi-CMOS IC

      IC Storage Conditions for Normal Packing(MSL1)/SMD Type Package

      No. TEST ITEM TEST CONDITION (*)PRE-CONDITION TIME n Reference
      1 High Temp. Operating Life Ta=125℃
      Voltage=Voperation max. Dynamic      		 No 1000h 22 JESD22-A108
      JESD85
      2 High Temp. Storage Life Ta=150℃ No 1000h 22 JESD22-A103
      3 Temp. Cycling Ta=-65to150℃ ①＋② 500cycles 22 JESD22-A104
      JESD22-A113
      4-1 HAST Ta=110℃ RH=85%
      Voltage=Voperation max. Static      		 ①＋② 264h 22 JESD22-A110
      JESD22-A113
      4-2 THB Ta=85℃ RH=85%
      Voltage=Voperation max. Static      		 ①＋② 1000h 22 JESD22-A101
      JESD22-A113
      5 UHAST Ta=110℃ RH=85% ①＋② 264h 22 JESD22-A118
      JESD22-A113
      6 Resistance To Soldering Heat 1 Reflow ① 3times 22 JESD22-A113
      J-STD-020
      7 Resistance To Soldering Heat 2 Flow ① 2times 22 JESD22-A111
      J-STD-002
      8 ESD-HBM C=100pF R=1.5k ohm ±2.0kV No Once 3 JS-001
      9 ESD-CDM ±1.0kV No Once 3 JS-002
      10 LU-I ±100mA No Once 3 JESD78
      Criteria：The electrical characteristics prescribed in the individual specifications shall be satisfied.
      • *）

        Pre-Condition

        The test shall be performed this pre-condition before testing.

        The baking condition is 125 ℃ 24h.

        MSL = LEVEL1

        • ①
          Ta=85℃, RH=85%, storage=168h
        • ②
          Reflow soldering heat stress (3times) or Flow soldering heat stress (2times)

        MSL = LEVEL2a

        • ①
          Ta=30℃, RH=60%, storage=696h　or Ta=60℃, RH=60%, storage=120h
        • ②
          Reflow soldering heat stress (3times) or Flow soldering heat stress (2times)

        MSL = LEVEL3

        • ①
          Ta=30℃, RH=60%, storage=192h　or Ta=60℃, RH=60%, storage=40h
        • ②
          Reflow soldering heat stress (3times) or Flow soldering heat stress (2times)
    • 3. GaAs IC

      IC Storage Conditions for Normal Packing(MSL1)/SMD Type Package

      No. TEST ITEM TEST CONDITION (*)PRE-CONDITION TIME n Reference
      1 High Temp. Operating Life Ta=125℃
      Voltage=Absolute Maximum Rating. Dynamic      		 No 1000h 22 JESD22-A108
      JESD85
      2 High Temp. Storage Life Ta=150℃ No 1000h 22 JESD22-A103
      3 Temp. Cycling Ta=-65to150℃ ①＋② 500cycles 22 JESD22-A104
      JESD22-A113
      4-1 HAST Ta=110℃ RH=85%
      Voltage=Absolute Maximum Rating.Static      		 ①＋② 264h 22 JESD22-A110
      JESD22-A113
      4-2 THB Ta=85℃ RH=85%
      Voltage=Absolute Maximum Rating.Static      		 ①＋② 1000h 22 JESD22-A101
      JESD22-A113
      5 UHAST Ta=110℃ RH=85% ①＋② 264h 22 JESD22-A118
      JESD22-A113
      6 Resistance To Soldering Heat 1 Reflow ① 3times 22 JESD22-A113
      J-STD-020
      7 Resistance To Soldering Heat 2 Flow ① 2times 22 JESD22-A111
      J-STD-002
      8 ESD-HBM C=100pF R=1.5k ohm ±2.0kV No Once 3 JS-001
      9 ESD-CDM ±1.0kV No Once 3 JS-002
      10 LU-I ±100mA No Once 3 JESD78
      Criteria：The electrical characteristics prescribed in the individual specifications shall be satisfied.
      • *）

        Pre-Condition

        The test shall be performed this pre-condition before testing.

        The baking condition is 125 ℃ 24h.

        MSL = LEVEL1

        • ①
          Ta=85℃, RH=85%, storage=168h
        • ②
          Reflow soldering heat stress (3times) or Flow soldering heat stress (2times)
    • 4. Opt Device

      Please make contact with us about detail information on each device.

  • former New Japan Radio Co., Ltd.

    We apply the reliability tests to new products, modified products (design, production equipment, process and materials) and process qualification. Reliability tests verify that our products attain the reliability target.

    Reliability Test Specifications (former New Japan Radio Co., Ltd.)

    • 1. Bipolar IC (NJM**)

      Bipolar IC (Electronic devices that part number starting with NJM)

      IC Storage Conditions for Normal Packing(MSL1)/SMD Type Package

      TEST Test Method
      EIAJ ED-4701      		 CONDITIONS SAMPLE
      SIZE
      High Temperature Storage 201 Tstgmax ,1000h 22
      Low Temperature Storage 202 Tstgmin ,1000h 22
      Humidity 103 85°C ,85% ,1000h 22
      Steady State Life 101 Tj=Tstgmax ,Voltage=Absolute Maximum Rating ,1000h 22
      Temperature Humidity Bias(THB) 102 85°C,85% ,Voltage=Absolute Maximum Rating ,1000h 22
      Pressure Cooker(PCT) - 121°C, 2.03×105Pa, 100%, 100h 22
      Soldering Heat 1 301 Reflow，Max260°C, 10s
      Precondition: 125°C 16h, 85°C 85% 168h      		 22
      Soldering Heat 2 301 260°C, 10s
      Precondition: 125°C 16h, 85°C 85% 168h      		 22
      Thermal Shock 307 0°C 5min to 100°C 5min,10 cycles 22
      Temperature Cycling 105 Tstgmin 30min to 25°C 5min to Tstgmax 30min,100 cycles 22
      Solderability - Sn-3.0Ag-0.5Cu ,245°C ,5s ,with flux 11

      IC Storage Conditions for Moisture-Proof Packing(Dry Pack1:MSL2a)/SMD Type Package

      TEST Test Method
      EIAJ ED-4701      		 CONDITIONS SAMPLE
      SIZE
      High Temperature Storage 201 Tstgmax ,1000h 22
      Low Temperature Storage 202 Tstgmin ,1000h 22
      Humidity 103 85°C ,85% ,1000h 22
      Steady State Life 101 Tj=Tstgmax ,Voltage=Absolute Maximum Rating ,1000h 22
      Temperature Humidity Bias(THB) 102 85°C,85% ,Voltage=Absolute Maximum Rating ,1000h 22
      Pressure Cooker(PCT) - 121°C ,2.03×105Pa ,100% ,100h 22
      Soldering Heat 1 301 Reflow Max260°C ,10s
      Precondition: 125°C 16h ,85°C 65% 168h      		 22
      Soldering Heat 2 301 260°C ,10s
      Precondition: 125°C 16h ,85°C 65% 168h      		 22
      Thermal Shock 307 0°C 5min to 100°C 5min ,10 cycles 22
      Temperature Cycling 105 Tstgmin 30min to 25°C 5min to Tstgmax 30min ,100 cycles 22
      Solderability - Sn-3.0Ag-0.5Cu ,245°C ,5s ,with flux 11

      IC Storage Conditions for Normal Packing(MSL1)/THD Type Package

      TEST Test Method
      EIAJ ED-4701      		 CONDITIONS SAMPLE
      SIZE
      High Temperature Storage 201 Tstgmax ,1000h 22
      Low Temperature Storage 202 Tstgmin ,1000h 22
      Humidity 103 85°C ,85% ,1000h 22
      Steady State Life 101 Tj=Tstgmax ,Voltage=Absolute Maximum Rating ,1000h 22
      Temperature Humidity Bias(THB) 102 85°C ,85% ,Voltage=Absolute Maximum Rating ,1000h 22
      Pressure Cooker(PCT) - 121°C ,2.03×105Pa ,100% ,100h 22
      Soldering Heat 302 260°C ,10s
      ,The dipping depth should be up to 1mm from the body
      of the specimen.      		 22
      Thermal Shock 307 0°C 5min to 100°C 5min ,10 cycles 22
      Temperature Cycling 105 Tstgmin 30min to 25°C 5min to Tstgmax 30min ,100 cycles 22
      Solderability - Sn-3.0Ag-0.5Cu ,245°C ,5s ,with flux 11
    • 2. CMOS IC (NJU**),
      Bi-CMOS IC (NJW**)

      CMOS IC (Electronic devices that part number starting with NJU),
      Bi-CMOS IC (Electronic devices that part number starting with NJW)

      IC Storage Conditions for Normal Packing(MSL1)/SMD Type Package

      TEST Test Method
      EIAJ ED-4701      		 CONDITIONS SAMPLE
      SIZE
      High Temperature Storage 201 Tstgmax ,1000h 22
      Low Temperature Storage 202 Tstgmin ,1000h 22
      Humidity 103 85°C ,85% ,1000h 22
      Steady State Life 101 Tj=Tstgmax ,Voltage=Voprmax ,1000h 22
      Temperature Humidity Bias(THB) 102 85°C ,85% ,Voltage=Voprmax ,1000h 22
      Pressure Cooker(PCT) - 121°C, 2.03×105Pa, 100%, 100h 22
      Soldering Heat 1 301 Reflow，Max260°C, 10s
      Precondition: 125°C 16h, 85°C 85% 168h      		 22
      Soldering Heat 2 301 260°C, 10s
      Precondition: 125°C 16h, 85°C 85% 168h      		 22
      Thermal Shock 307 0°C 5min to 100°C 5min,10 cycles 22
      Temperature Cycling 105 Tstgmin 30min to 25°C 5min to Tstgmax 30min,100 cycles 22
      Solderability - Sn-3.0Ag-0.5Cu ,245°C ,5s ,with flux 11

      IC Storage Conditions for Moisture-Proof Packing(Dry Pack1:MSL2a)/SMD Type Package

      TEST Test Method
      EIAJ ED-4701      		 CONDITIONS SAMPLE
      SIZE
      High Temperature Storage 201 Tstgmax ,1000h 22
      Low Temperature Storage 202 Tstgmin ,1000h 22
      Humidity 103 85°C ,85% ,1000h 22
      Steady State Life 101 Tj=Tstgmax ,Voltage=Voprmax ,1000h 22
      Temperature Humidity Bias(THB) 102 85°C,85% ,Voltage=Voprmax ,1000h 22
      Pressure Cooker(PCT) - 121°C ,2.03×105Pa ,100% ,100h 22
      Soldering Heat 1 301 Reflow Max260°C ,10s
      Precondition: 125°C 16h ,85°C 65% 168h      		 22
      Soldering Heat 2 301 260°C ,10s
      Precondition: 125°C 16h ,85°C 65% 168h      		 22
      Thermal Shock 307 0°C 5min to 100°C 5min ,10 cycles 22
      Temperature Cycling 105 Tstgmin 30min to 25°C 5min to Tstgmax 30min ,100 cycles 22
      Solderability - Sn-3.0Ag-0.5Cu ,245°C ,5s ,with flux 11

      IC Storage Conditions for Deaeration Packing(Dry Pack2:MSL3)/SMD Type Package

      TEST Test Method
      EIAJ ED-4701      		 CONDITIONS SAMPLE
      SIZE
      High Temperature Storage 201 Tstgmax ,1000h 22
      Low Temperature Storage 202 Tstgmin ,1000h 22
      Humidity 103 85°C ,85% ,1000h 22
      Steady State Life 101 Tj=Tstgmax ,Voltage=Voprmax ,1000h 22
      Temperature Humidity Bias(THB) 102 85°C ,85% ,Voltage=Voprmax ,1000h 22
      Pressure Cooker(PCT) - 121°C ,2.03×105Pa ,100% ,100h 22
      Soldering Heat 1 301 Reflow ,Max260°C ,10s
      Precondition: 125°C 16h, 85°C 30% 168h, 30°C 70% 168h ,30°C 70% 72h      		 22
      Soldering Heat 2 301 Max260°C ,10s
      Precondition: 125°C 16h, 85°C 30% 168h, 30°C 70% 168h ,30°C 70% 72h      		 22
      Thermal Shock 307 0°C 5min to 100°C 5min ,10 cycles 22
      Temperature Cycling 105 Tstgmin 30min to 25°C 5min to Tstgmax 30min ,100 cycles 22
      Solderability - Sn-3.0Ag-0.5Cu ,245°C ,5s ,with flux 11

      IC Storage Conditions for Normal Packing(MSL1)/THD Type Package

      TEST Test Method
      EIAJ ED-4701      		 CONDITIONS SAMPLE
      SIZE
      High Temperature Storage 201 Tstgmax ,1000h 22
      Low Temperature Storage 202 Tstgmin ,1000h 22
      Humidity 103 85°C ,85% ,1000h 22
      Steady State Life 101 Tj=Tstgmax ,Voltage=Voprmax ,1000h 22
      Temperature Humidity Bias(THB) 102 85°C ,85% ,Voltage=Voprmax ,1000h 22
      Pressure Cooker(PCT) - 121°C ,2.03×105Pa ,100% ,100h 22
      Soldering Heat 302 260°C ,10s
      ,The dipping depth should be up to 1mm
      from the body of the specimen.      		 22
      Thermal Shock 307 0°C 5min to 100°C 5min ,10 cycles 22
      Temperature Cycling 105 Tstgmin 30min to 25°C 5min to Tstgmax 30min ,100 cycles 22
      Solderability - Sn-3.0Ag-0.5Cu ,245°C ,5s ,with flux 11
    • 3. GaAs IC (NJG**)

      GaAs IC (Electronic devices that part number starting with NJG)

      IC Storage Conditions for Normal Packing(MSL1)/SMD Type Package

      TEST Test Method
      EIAJ ED-4701      		 CONDITIONS SAMPLE
      SIZE
      High Temperature Storagee 201 Tstgmax ,1000h 22
      Low Temperature Storage 202 Tstgmin ,1000h 22
      Humidity 103 85°C ,85% ,1000h 22
      Steady State Life 101 Tj=Tstgmax ,Voltage=Absolute Maximum Rating ,1000h 22
      Temperature Humidity Bias(THB) 102 85°C,85% ,Voltage=Absolute Maximum Rating ,1000h 22
      Pressure Cooker(PCT) - 121°C ,2.03×105Pa ,100% ,40h 22
      Soldering Heat 1 301 Reflow，Max260°C, 10s
      Precondition: 125°C 16h, 85°C 85% 168h      		 22
      Soldering Heat 2 301 260°C, 10s
      Precondition: 125°C 16h, 85°C 85% 168h      		 22
      Thermal Shock 307 0°C 5min to 100°C 5min ,10 cycles 22
      Temperature Cycling 105 Tstgmin 30min to 25°C 5min to Tstgmax 30min,100 cycles 22
      Solderability - Sn-3.0Ag-0.5Cu ,245°C ,5s ,with flux 11
    • 4. Opt Device (NJL**)

      Opt Device (Electronic devices that part number starting with NJL)

      Please make contact with us about detail information on each device.

  • former RICOH Electronic Devices Co., Ltd.

    Reliability Test Specifications (former RICOH Electronic Devices Co., Ltd.)

    Electronic devices that part number starting with R

    Reliability reports are open to the public on each product page.

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