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Wafer Foundry—Kawagoe Plant

As a leading foundry manufacturer for analog and mixed-signal products, Nisshinbo Micro Devices Inc. offers highly reliable process technologies, which are well optimized in our own product development.
The technologies are ranging from 4.0 to 0.35µm, and Bipolar, CMOS with HVMOS, high speed BiCMOS, and BCD. Since the technologies are available on 5", and 8" wafers, Nisshinbo Micro Devices can appropriately respond to wide range production volume with our two manufacturing fab and UMC' 8" fab.

Process

Process PDF Details
Complimentary 40V High Speed Bipolar with TFR
Application : OpAmp
126KB 2.0µm rule
NPN ft= 2.9GHz, Vertical PNP ft= 3.7GHz
Wafer Size 5"
High Speed BiCMOS
Application : Industrial, Visual, Sensor AFE
217KB 0.8μm rule
Bipolar 10V NPN ft= 8.0GHz, Vertical PNP ft= 5.5GHz, CMOS 5V
Wafer Size 5"
Analog CMOS+HV
Application : Power Supply, Audio, OpAmp
212KB 0.7µm rule
LV 5V, HV 20V/30V/36V
Wafer Size 5"
BCD
Application : Power Supply, OpAmp
Please contact us. 0.35µm rule
Bipolar 15V NPN, LPNP, CMOS 3.3V/5.0V, DMOS 40V/50V
Wafer Size 8"(*1)
Analog CMOS+HV
Application : Power Supply, OpAmp
Please contact us. 0.35µm rule
LV 3.3V, MV 5.0V, HV 12~36V
Wafer Size 8"(*1)

(*1) :This process was developed in cooperation with UMC.

Inspection Items on Foundry Service

  • Process control monitor (Device characteristics)
  • Appearance defects

Optional Services

  • Wafer sort
  • Final Test
  • Package

Product Forms

The PCM data is attached to the product at delivery.

  • Wafer
  • Bare die

Business Flow

The standard business flow of foundry service is as follows. If you have any questions, please contuct us.

Development Process Figure

Contact Us

For inquiries about our foundry services, please use this form. A representative will contact you.