HSOP-8-AC

Package HSOP-8-AC
Pin 8
Dimensions (mm) 5.2×6.2
Thickness (mm) 1.5
Pitch (mm) 1.27
Solder Ball (mm)
Plating Sn
Product Mass (mg) 81
Moisture Sensitivity Level (MSL) 1
Recommend Mounting Reflow
Quantity/Reel (pcs) 1000
Taping Direction E2
Non-use Certificate RoHSⅡ
Non-use Certificate REACH
Non-use Certificate Halogen Free

* Refer to the datasheet for the power dissipation of each product.

HSOP-8-AC

Related Package

Download (Package dimension, Taping specification, Taping reels dimension, Power dissipation and Land pattern (Foot pattern))

Package information

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