HSOP-8-AC

Package	HSOP-8-AC
Pin	8
Dimensions (mm)	5.2×6.2
Thickness (mm)	1.5
Pitch (mm)	1.27
Solder Ball (mm)
Plating	Sn
Product Mass (mg)	81
Moisture Sensitivity Level (MSL)	1
Recommend Mounting	Reflow
Quantity/Reel (pcs)	1000
Taping Direction	E2
Non-use Certificate RoHSⅡ
Non-use Certificate REACH
Non-use Certificate Halogen Free

* Refer to the datasheet for the power dissipation of each product.

Related Package

Download (Package dimension, Taping specification, Taping reels dimension, Power dissipation and Land pattern (Foot pattern))

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