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HSOP8-M1

Package HSOP8-M1
Pin 8
Dimensions (mm) 4.4x5.2
Thickness (mm) 1.55
Pitch (mm) 1.27
Solder Ball (mm)
Plating Pure Sn
Product Mass (mg) 81
Moisture Sensitivity Level (MSL) 1
Recommend Mounting Reflow:OK
Quantity/Reel (pcs) 3000
Taping Direction TE1/TE2
Non-use Certificate RoHSⅡ
Non-use Certificate REACH
Non-use Certificate Halogen Free

* Refer to the datasheet for the power dissipation of each product.

HSOP8-M1

Related Package

Download (Package dimension, Taping specification, Taping reels dimension and Land pattern (Foot pattern))

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