"3D Integration of Thin-Film Analog ICs – Fusion of Analog Stacked Circuit and CFB Technologies" Receives 2025 Semiconductor of the Year Award for Excellence.
Nisshinbo Micro Devices Inc. is pleased to announce that it has received 2025 Semiconductor of the Year Award for Excellence, hosted by Sangyo Times, Inc. The award ceremony and technical presentation were held on June 4.
The award-winning technology, "3D Integration of Thin-Film Analog ICs – Fusion of Analog Stacked Circuit and CFB Technologies," is a groundbreaking innovation that combines Nisshinbo’s longstanding analog IC expertise with OKI’s CFB technology. This fusion has enabled miniaturization through vertical stacking while maintaining analog performance, significantly reducing chip area and achieving higher density and functionality in analog circuits.
Semiconductor of the Year is a prestigious award presented by Sangyo Times, publisher of the Electronic Device Industry News. Winners are selected through a rigorous evaluation by editors based on criteria such as technological innovation, mass-production readiness, societal impact, and future potential. This marks the first time Nisshinbo Micro Devices has received this award.
We remain committed to addressing social challenges and advancing the semiconductor industry through continuous innovation.
Comments from the Award Recipients
Yoshioka, Representative Director, President
We are truly honored to receive the 2025 Semiconductor of the Year Award for Excellence.
I firmly believe that this technology represents a major leap forward in 3D integration for analog semiconductors. It is the result of the close collaboration between OKI and Nisshinbo, bringing together years of accumulated expertise and know-how. We will continue to work with our partners to offer technical solutions that solve real-world challenges for our customers.
Hara, Managing Officer
I feel a great sense of responsibility and renewed determination upon receiving this prestigious award. This achievement is the result of the shared commitment and technical strength built over many years through our partnership with OKI. I would like to express my sincere appreciation to everyone involved. Moving forward, we will further strengthen our collaboration with OKI, accelerate efforts toward mass production, and continue to contribute meaningfully to society.
Ogata, Senior Technical Manager
A dream once imagined has finally come true. The tone produced by our 5μm-thin analog IC signals the future of semiconductors. Sharing this excitement with the development team was both a joyful and meaningful experience. The collaboration between OKI’s CFB technology and our analog IC design expertise has created entirely new value, and I am delighted by the results. This technology is a solid step toward pioneering the future of semiconductors and holds the potential to bring about novel devices not yet seen in the world. We are steadily advancing the planning and evaluation of products based on this technology, and we look forward to presenting them to the public soon.
Related Links
Nisshinbo Micro Devices and OKI Achieve Thin-Film and 3D Integration of Analog ICs – Significant Chip Area Reduction Using Existing Processes
( https://www.nisshinbo-microdevices.co.jp/en/about/info/20250128.html）
Semiconductor of the Year 2025
( https://www.sangyo-times.jp/seminarDtl.aspx?ID=595)
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