WLCSP-9-P1

Package	WLCSP-9-P1
Pin	9
Dimensions (mm)	1.27×1.27
Thickness (mm)	0.69
Pitch (mm)	0.4
Solder Ball (mm)	0.26
Plating	Sn3Ag0.5Cu
Product Mass (mg)	2.2
Moisture Sensitivity Level (MSL)	1
Recommend Mounting	Reflow
Quantity/Reel (pcs)	5000
Taping Direction	E2
Non-use Certificate RoHSⅡ
Non-use Certificate REACH
Non-use Certificate Halogen Free

* Refer to the datasheet for the power dissipation of each product.

Download (Package dimension, Taping specification, Taping reels dimension, Power dissipation and Land pattern (Foot pattern))

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