WLCSP-9-P1

Package WLCSP-9-P1
Pin 9
Dimensions (mm) 1.27×1.27
Thickness (mm) 0.69
Pitch (mm) 0.4
Solder Ball (mm) 0.26
Plating Sn3Ag0.5Cu
Product Mass (mg) 2.2
Moisture Sensitivity Level (MSL) 1
Recommend Mounting Reflow
Quantity/Reel (pcs) 5000
Taping Direction E2
Non-use Certificate RoHSⅡ
Non-use Certificate REACH
Non-use Certificate Halogen Free

* Refer to the datasheet for the power dissipation of each product.

WLCSP-9-P1

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