FAQ：Package
FAQ：Package
- Where is the information on the recommended landing patterns?
- Is ESD resistance changed by each other package?
- How can I calculate the power dissipation of an LDO regulator?
- What must be taken into account to lay out PCB?
- Are there any suitable products for AOI (automatic optical inspection)?
- What is junction temperature?
- What is thermal resistance?
- Do Ψjt, θja, and power dissipation vary by the size of the board? How can I predict the power dissipation, the Ψjt, and the θja of the board we have designed?
- What do the squared values or characters in the outline drawings of packages mean?
- How should the tab on the bottom surface of DFN (PL) packages be connected?