可靠性测试规范（电子器件产品）

  • ⽇清纺微电⼦株式会社

    在可靠性测试中，我们对新产品开发、变更产品认证、工艺认证时指定的项目进行测试，并确认包含目标可靠性。

    可靠性测试规范

    • 1. Bipolar IC

      IC Storage Conditions for Normal Packing(MSL1)/SMD Type Package

      No. TEST ITEM TEST CONDITION (*)PRE-CONDITION TIME n Reference
      1 High Temp. Operating Life Ta=125℃
      Voltage=Absolute Maximum Rating. Dynamic      		 No 1000h 22 JESD22-A108
      JESD85
      2 High Temp. Storage Ta=150℃ No 1000h 22 JESD22-A103
      3 Temp. Cycle Ta=-65～150℃ ①＋② 500cycles 22 JESD22-A104
      JESD22-A113
      4-1 HAST Ta=110℃ RH=85%
      Voltage=Absolute Maximum Rating.Static      		 ①＋② 264h 22 JESD22-A110
      JESD22-A113
      4-2 THB Ta=85℃ RH=85%
      Voltage=Absolute Maximum Rating.Static      		 ①＋② 1000h 22 JESD22-A101
      JESD22-A113
      5 UHAST Ta=110℃ RH=85% ①＋② 264h 22 JESD22-A118
      JESD22-A113
      6 Resistance To Soldering Heat 1 Reflow ① 3times 22 JESD22-A113
      J-STD-020
      7 Resistance To Soldering Heat 2 Flow ① 2times 22 JESD22-A111
      J-STD-002
      8 ESD-HBM C=100pF R=1.5k ohm ±2.0kV No Once 3 JS-001
      9 ESD-CDM ±1.0kV No Once 3 JS-002
      10 LU-I ±100mA No Once 3 JESD78
      Criteria：The electrical characteristics prescribed in the individual specifications shall be satisfied.
      • *）

        Pre-Condition

        The test shall be performed this pre-condition before testing.

        The baking condition is 125 ℃ 24h.

        MSL = 1

        • ①
          Ta=85℃, RH=85%, storage=168h
        • ②
          Reflow soldering heat stress (3times) or Flow soldering heat stress (2times)

        MSL = 2a

        • ①
          Ta=30℃, RH=60%, storage=696h　or Ta=60℃, RH=60%, storage=120h
        • ②
          Reflow soldering heat stress (3times) or Flow soldering heat stress (2times)

        MSL = 3

        • ①
          Ta=30℃, RH=60%, storage=192h　or Ta=60℃, RH=60%, storage=40h
        • ②
          Reflow soldering heat stress (3times) or Flow soldering heat stress (2times)
    • 2. CMOS IC,Bi-CMOS IC

      IC Storage Conditions for Normal Packing(MSL1)/SMD Type Package

      No. TEST ITEM TEST CONDITION (*)PRE-CONDITION TIME n Reference
      1 High Temp. Operating Life Ta=125℃
      Voltage=Voperation max. Dynamic      		 No 1000h 22 JESD22-A108
      JESD85
      2 High Temp. Storage Ta=150℃ No 1000h 22 JESD22-A103
      3 Temp. Cycle Ta=-65～150℃ ①＋② 500cycles 22 JESD22-A104
      JESD22-A113
      4-1 HAST Ta=110℃ RH=85%
      Voltage=Voperation max. Static      		 ①＋② 264h 22 JESD22-A110
      JESD22-A113
      4-2 THB Ta=85℃ RH=85%
      Voltage=Voperation max. Static      		 ①＋② 1000h 22 JESD22-A101
      JESD22-A113
      5 UHAST Ta=110℃ RH=85% ①＋② 264h 22 JESD22-A118
      JESD22-A113
      6 Resistance To Soldering Heat 1 Reflow ① 3times 22 JESD22-A113
      J-STD-020
      7 Resistance To Soldering Heat 2 Flow ① 2times 22 JESD22-A111
      J-STD-002
      8 ESD-HBM C=100pF R=1.5k ohm ±2.0kV No Once 3 JS-001
      9 ESD-CDM ±1.0kV No Once 3 JS-002
      10 LU-I ±100mA No Once 3 JESD78
      Criteria：The electrical characteristics prescribed in the individual specifications shall be satisfied.
      • *）

        Pre-Condition

        The test shall be performed this pre-condition before testing.

        The baking condition is 125 ℃ 24h.

        MSL = 1

        • ①
          Ta=85℃, RH=85%, storage=168h
        • ②
          Reflow soldering heat stress (3times) or Flow soldering heat stress (2times)

        MSL = 2a

        • ①
          Ta=30℃, RH=60%, storage=696h　or Ta=60℃, RH=60%, storage=120h
        • ②
          Reflow soldering heat stress (3times) or Flow soldering heat stress (2times)

        MSL = 3

        • ①
          Ta=30℃, RH=60%, storage=192h　or Ta=60℃, RH=60%, storage=40h
        • ②
          Reflow soldering heat stress (3times) or Flow soldering heat stress (2times)
    • 3. GaAs IC

      IC Storage Conditions for Normal Packing(MSL1)/SMD Type Package

      No. TEST ITEM TEST CONDITION (*)PRE-CONDITION TIME n Reference
      1 High Temp. Operating Life Ta=125℃
      Voltage=Absolute Maximum Rating. Dynamic      		 No 1000h 22 JESD22-A108
      JESD85
      2 High Temp. Storage Ta=150℃ No 1000h 22 JESD22-A103
      3 Temp. Cycle Ta=-65～150℃ ①＋② 500cycles 22 JESD22-A104
      JESD22-A113
      4-1 HAST Ta=110℃ RH=85%
      Voltage=Absolute Maximum Rating.Static      		 ①＋② 264h 22 JESD22-A110
      JESD22-A113
      4-2 THB Ta=85℃ RH=85%
      Voltage=Absolute Maximum Rating.Static      		 ①＋② 1000h 22 JESD22-A101
      JESD22-A113
      5 UHAST Ta=110℃ RH=85% ①＋② 264h 22 JESD22-A118
      JESD22-A113
      6 Resistance To Soldering Heat 1 Reflow ① 3times 22 JESD22-A113
      J-STD-020
      7 Resistance To Soldering Heat 2 Flow ① 2times 22 JESD22-A111
      J-STD-002
      8 ESD-HBM C=100pF R=1.5k ohm ±2.0kV No Once 3 JS-001
      9 ESD-CDM ±1.0kV No Once 3 JS-002
      10 LU-I ±100mA No Once 3 JESD78
      Criteria：The electrical characteristics prescribed in the individual specifications shall be satisfied.
      • *）

        Pre-Condition

        The test shall be performed this pre-condition before testing.

        The baking condition is 125 ℃ 24h.

        MSL = 1

        • ①
          Ta=85℃, RH=85%, storage=168h
        • ②
          Reflow soldering heat stress (3times) or Flow soldering heat stress (2times)
    • 4. Opt Device

      Please make contact with us about detail information on each device.

  • 原新日本无线株式会社

    在可靠性测试中，我们对新产品开发、变更产品认证、工艺认证时指定的项目进行测试，并确认包含目标可靠性。

    可靠性测试规范 (原新日本无线株式会社)

    • 1. Bipolar IC (NJM＊＊)

      Bipolar IC (以NJM开头的电子器件产品)

      IC Storage Conditions for Normal Packing(MSL1)/SMD Type Package

      TEST Test Method
      EIAJ ED-4701      		 CONDITIONS SAMPLE
      SIZE
      High Temperature Storage 201 Tstgmax ,1000h 22
      Low Temperature Storage 202 Tstgmin ,1000h 22
      Humidity 103 85°C ,85% ,1000h 22
      Steady State Life 101 Tj=Tstgmax ,Voltage=Absolute Maximum Rating ,1000h 22
      Temperature Humidity Bias(THB) 102 85°C,85% ,Voltage=Absolute Maximum Rating ,1000h 22
      Pressure Cooker(PCT) - 121°C, 2.03×105Pa, 100%, 100h 22
      Soldering Heat 1 301 Reflow，Max260°C, 10s
      Precondition: 125°C 16h, 85°C 85% 168h      		 22
      Soldering Heat 2 301 260°C, 10s
      Precondition: 125°C 16h, 85°C 85% 168h      		 22
      Thermal Shock 307 0°C 5min to 100°C 5min,10 cycles 22
      Temperature Cycling 105 Tstgmin 30min to 25°C 5min to Tstgmax 30min,100 cycles 22
      Solderability - Sn-3.0Ag-0.5Cu ,245°C ,5s ,with flux 11

      IC Storage Conditions for Moisture-Proof Packing(Dry Pack1:MSL2a)/SMD Type Package

      TEST Test Method
      EIAJ ED-4701      		 CONDITIONS SAMPLE
      SIZE
      High Temperature Storage 201 Tstgmax ,1000h 22
      Low Temperature Storage 202 Tstgmin ,1000h 22
      Humidity 103 85°C ,85% ,1000h 22
      Steady State Life 101 Tj=Tstgmax ,Voltage=Absolute Maximum Rating ,1000h 22
      Temperature Humidity Bias(THB) 102 85°C,85% ,Voltage=Absolute Maximum Rating ,1000h 22
      Pressure Cooker(PCT) - 121°C ,2.03×105Pa ,100% ,100h 22
      Soldering Heat 1 301 Reflow Max260°C ,10s
      Precondition: 125°C 16h ,85°C 65% 168h      		 22
      Soldering Heat 2 301 260°C ,10s
      Precondition: 125°C 16h ,85°C 65% 168h      		 22
      Thermal Shock 307 0°C 5min to 100°C 5min ,10 cycles 22
      Temperature Cycling 105 Tstgmin 30min to 25°C 5min to Tstgmax 30min ,100 cycles 22
      Solderability - Sn-3.0Ag-0.5Cu ,245°C ,5s ,with flux 11

      IC Storage Conditions for Normal Packing(MSL1)/THD Type Package

      TEST Test Method
      EIAJ ED-4701      		 CONDITIONS SAMPLE
      SIZE
      High Temperature Storage 201 Tstgmax ,1000h 22
      Low Temperature Storage 202 Tstgmin ,1000h 22
      Humidity 103 85°C ,85% ,1000h 22
      Steady State Life 101 Tj=Tstgmax ,Voltage=Absolute Maximum Rating ,1000h 22
      Temperature Humidity Bias(THB) 102 85°C ,85% ,Voltage=Absolute Maximum Rating ,1000h 22
      Pressure Cooker(PCT) - 121°C ,2.03×105Pa ,100% ,100h 22
      Soldering Heat 302 260°C ,10s
      ,The dipping depth should be up to 1mm from the body
      of the specimen.      		 22
      Thermal Shock 307 0°C 5min to 100°C 5min ,10 cycles 22
      Temperature Cycling 105 Tstgmin 30min to 25°C 5min to Tstgmax 30min ,100 cycles 22
      Solderability - Sn-3.0Ag-0.5Cu ,245°C ,5s ,with flux 11
    • 2. CMOS IC (NJU＊＊),
      Bi-CMOS IC (NJW＊＊)

      CMOS IC (以NJU开头的电子器件产品), Bi-CMOS IC (以NJW开头的电子器件产品)

      IC Storage Conditions for Normal Packing(MSL1)/SMD Type Package

      TEST Test Method
      EIAJ ED-4701      		 CONDITIONS SAMPLE
      SIZE
      High Temperature Storage 201 Tstgmax ,1000h 22
      Low Temperature Storage 202 Tstgmin ,1000h 22
      Humidity 103 85°C ,85% ,1000h 22
      Steady State Life 101 Tj=Tstgmax ,Voltage=Voprmax ,1000h 22
      Temperature Humidity Bias(THB) 102 85°C ,85% ,Voltage=Voprmax ,1000h 22
      Pressure Cooker(PCT) - 121°C, 2.03×105Pa, 100%, 100h 22
      Soldering Heat 1 301 Reflow，Max260°C, 10s
      Precondition: 125°C 16h, 85°C 85% 168h      		 22
      Soldering Heat 2 301 260°C, 10s
      Precondition: 125°C 16h, 85°C 85% 168h      		 22
      Thermal Shock 307 0°C 5min to 100°C 5min,10 cycles 22
      Temperature Cycling 105 Tstgmin 30min to 25°C 5min to Tstgmax 30min,100 cycles 22
      Solderability - Sn-3.0Ag-0.5Cu ,245°C ,5s ,with flux 11

      IC Storage Conditions for Moisture-Proof Packing(Dry Pack1:MSL2a)/SMD Type Package

      TEST Test Method
      EIAJ ED-4701      		 CONDITIONS SAMPLE
      SIZE
      High Temperature Storage 201 Tstgmax ,1000h 22
      Low Temperature Storage 202 Tstgmin ,1000h 22
      Humidity 103 85°C ,85% ,1000h 22
      Steady State Life 101 Tj=Tstgmax ,Voltage=Voprmax ,1000h 22
      Temperature Humidity Bias(THB) 102 85°C,85% ,Voltage=Voprmax ,1000h 22
      Pressure Cooker(PCT) - 121°C ,2.03×105Pa ,100% ,100h 22
      Soldering Heat 1 301 Reflow Max260°C ,10s
      Precondition: 125°C 16h ,85°C 65% 168h      		 22
      Soldering Heat 2 301 260°C ,10s
      Precondition: 125°C 16h ,85°C 65% 168h      		 22
      Thermal Shock 307 0°C 5min to 100°C 5min ,10 cycles 22
      Temperature Cycling 105 Tstgmin 30min to 25°C 5min to Tstgmax 30min ,100 cycles 22
      Solderability - Sn-3.0Ag-0.5Cu ,245°C ,5s ,with flux 11

      IC Storage Conditions for Deaeration Packing(Dry Pack2:MSL3)/SMD Type Package

      TEST Test Method
      EIAJ ED-4701      		 CONDITIONS SAMPLE
      SIZE
      High Temperature Storage 201 Tstgmax ,1000h 22
      Low Temperature Storage 202 Tstgmin ,1000h 22
      Humidity 103 85°C ,85% ,1000h 22
      Steady State Life 101 Tj=Tstgmax ,Voltage=Voprmax ,1000h 22
      Temperature Humidity Bias(THB) 102 85°C ,85% ,Voltage=Voprmax ,1000h 22
      Pressure Cooker(PCT) - 121°C ,2.03×105Pa ,100% ,100h 22
      Soldering Heat 1 301 Reflow ,Max260°C ,10s
      Precondition: 125°C 16h, 85°C 30% 168h, 30°C 70% 168h ,30°C 70% 72h      		 22
      Soldering Heat 2 301 Max260°C ,10s
      Precondition: 125°C 16h, 85°C 30% 168h, 30°C 70% 168h ,30°C 70% 72h      		 22
      Thermal Shock 307 0°C 5min to 100°C 5min ,10 cycles 22
      Temperature Cycling 105 Tstgmin 30min to 25°C 5min to Tstgmax 30min ,100 cycles 22
      Solderability - Sn-3.0Ag-0.5Cu ,245°C ,5s ,with flux 11

      IC Storage Conditions for Normal Packing(MSL1)/THD Type Package

      TEST Test Method
      EIAJ ED-4701      		 CONDITIONS SAMPLE
      SIZE
      High Temperature Storage 201 Tstgmax ,1000h 22
      Low Temperature Storage 202 Tstgmin ,1000h 22
      Humidity 103 85°C ,85% ,1000h 22
      Steady State Life 101 Tj=Tstgmax ,Voltage=Voprmax ,1000h 22
      Temperature Humidity Bias(THB) 102 85°C ,85% ,Voltage=Voprmax ,1000h 22
      Pressure Cooker(PCT) - 121°C ,2.03×105Pa ,100% ,100h 22
      Soldering Heat 302 260°C ,10s
      ,The dipping depth should be up to 1mm
      from the body of the specimen.      		 22
      Thermal Shock 307 0°C 5min to 100°C 5min ,10 cycles 22
      Temperature Cycling 105 Tstgmin 30min to 25°C 5min to Tstgmax 30min ,100 cycles 22
      Solderability - Sn-3.0Ag-0.5Cu ,245°C ,5s ,with flux 11
    • 3. GaAs IC (NJG＊＊)

      GaAs IC (以NJG开头的电子器件产品)

      IC Storage Conditions for Normal Packing(MSL1)/SMD Type Package

      TEST Test Method
      EIAJ ED-4701      		 CONDITIONS SAMPLE
      SIZE
      High Temperature Storagee 201 Tstgmax ,1000h 22
      Low Temperature Storage 202 Tstgmin ,1000h 22
      Humidity 103 85°C ,85% ,1000h 22
      Steady State Life 101 Tj=Tstgmax ,Voltage=Absolute Maximum Rating ,1000h 22
      Temperature Humidity Bias(THB) 102 85°C,85% ,Voltage=Absolute Maximum Rating ,1000h 22
      Pressure Cooker(PCT) - 121°C ,2.03×105Pa ,100% ,40h 22
      Soldering Heat 1 301 Reflow，Max260°C, 10s
      Precondition: 125°C 16h, 85°C 85% 168h      		 22
      Soldering Heat 2 301 260°C, 10s
      Precondition: 125°C 16h, 85°C 85% 168h      		 22
      Thermal Shock 307 0°C 5min to 100°C 5min ,10 cycles 22
      Temperature Cycling 105 Tstgmin 30min to 25°C 5min to Tstgmax 30min,100 cycles 22
      Solderability - Sn-3.0Ag-0.5Cu ,245°C ,5s ,with flux 11
    • 4. Opt Device (NJL＊＊)

      Opt Device (以NJL开头的电子器件产品)

      Please make contact with us about detail information on each device.

  • 原理光微电子株式会社

    可靠性测试规范 (原理光微电子株式会社)

    以R开头的电子器件产品

    可靠性测试报告发布在每个产品页面上。

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