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WLCSP-8-P10

Package WLCSP-8-P10
Pin 8
Dimensions (mm) 1.6×1.0
Thickness (mm) 0.3
Pitch (mm) X=0.4, Y=0.6
Solder Ball (mm) 0.16
Plating Sn3.0Ag0.5Cu
Product Mass (mg) 0.73
Moisture Sensitivity Level (MSL) 1
Recommend Mounting Reflow
Quantity/Reel (pcs) 5000
Taping Direction E2
Non-use Certificate RoHSⅡ
Non-use Certificate REACH
Non-use Certificate Halogen Free

* Refer to the datasheet for the power dissipation of each product.

WLCSP-8-P10

Download (Package dimension, Taping specification, Taping reels dimension and Land pattern (Foot pattern))

Package information

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