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WLCSP-20-P1

Package WLCSP-20-P1
Pin 20
Dimensions (mm) 2.305×1.70
Thickness (mm) 0.59
Pitch (mm) 0.4
Solder Ball (mm) 0.265
Plating Sn3Ag0.5Cu
Product Mass (mg) 4.54
Moisture Sensitivity Level (MSL) 1
Recommend Mounting Reflow
Quantity/Reel (pcs) 5000
Taping Direction E2
Non-use Certificate RoHSⅡ
Non-use Certificate REACH
Non-use Certificate Halogen Free

* Refer to the datasheet for the power dissipation of each product.

WLCSP-20-P1

Download (Package dimension, Taping specification, Taping reels dimension, Power dissipation and Land pattern (Foot pattern))

Package information

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