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WLCSP-12-P1

Package WLCSP-12-P1
Pin 12
Dimensions (mm) 1.97×1.47
Thickness (mm) 0.86
Pitch (mm) 0.4
Solder Ball (mm) 0.26
Plating Sn3Ag0.5Cu
Product Mass (mg) 4.7
Moisture Sensitivity Level (MSL) 1
Recommend Mounting Reflow
Quantity/Reel (pcs) 4000
Taping Direction E2
Non-use Certificate RoHSⅡ
Non-use Certificate REACH
Non-use Certificate Halogen Free

* Refer to the datasheet for the power dissipation of each product.

WLCSP-12-P1

Download (Package dimension, Taping specification, Taping reels dimension, Power dissipation and Land pattern (Foot pattern))

Package information

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