TSSOP10G

Package TSSOP10G
Pin 10
Dimensions (mm) 2.9×4.0
Thickness (mm) 0.75
Pitch (mm) 0.5
Solder Ball (mm)
Plating Sn2Bi
Product Mass (mg) 18.5
Moisture Sensitivity Level (MSL) 1
Recommend Mounting Reflow
Quantity/Reel (pcs) 2000
Taping Direction E2
Non-use Certificate RoHSⅡ
Non-use Certificate REACH
Non-use Certificate Halogen Free

* Refer to the datasheet for the power dissipation of each product.

TSSOP10G

Download (Package dimension, Taping specification, Taping reels dimension, Power dissipation and Land pattern (Foot pattern))

Package information

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