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WLCSP-8-P1

Package WLCSP-8-P1
Pin 8
Dimensions (mm) 1.45×1.48
Thickness (mm) 0.4
Pitch (mm) 0.4
Solder Ball (mm) 0.245
Plating Sn3Ag0.5Cu
Product Mass (mg) 1.85
Moisture Sensitivity Level (MSL) 1
Recommend Mounting Reflow
Quantity/Reel (pcs) 5000
Taping Direction TR
Non-use Certificate RoHSⅡ
Non-use Certificate REACH
Non-use Certificate Halogen Free

* Refer to the datasheet for the power dissipation of each product.

WLCSP-8-P1

Download (Package dimension, Taping specification, Taping reels dimension, Power dissipation and Land pattern (Foot pattern))

Package information

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