What is the reason that a spice model is not according to each of the package?

Macro Model

Basically, the operation of the IC does not change from package to package. The parameter that changes due to a change in package is the power dissipation. The SPICE model (macro model) provided by Nisshinbo Micro Devices is not fit to the power dissipation. Therefore, there is no need to change the SPICE model (macromodel) for each package.

However, there are cases where the datasheet shows the characteristic difference between packages (e.g., Vdif of LDO). In such cases, Nisshinbo Micro Devices SPICE model based on the inferior one at electrical characteristics.