Are there any precautions in handling FEMs (Front-end modules) for GNSS?

• * This FAQ mainly explains GaAs products using GaAs substrates and RF CMOS products using SOI technology.

RF Device

Our FEMs adopt HFFP packages and their structures are susceptible to mechanical stress from outside.
Therefore, please note the following points and conduct evaluation before using them.

• To implement potting and transfer-molding after mounting this product, please check resistance to temperature changes and shrinkage stress involved in the molding.
• In mounting the product, please use a collet with a diameter of 1 mmφ or more. In addition, a static load of 5N or less is recommended for mounting.
• Please check the dynamic load in consideration of the contact area, speed, load, etc. before using the products.