CSP0606-85

Package CSP0606-85
Pin 85
Dimensions (mm) 6.0×6.0
Thickness (mm) 1.07
Pitch (mm) 0.5
Solder Ball (mm)
Plating Sn3Ag0.5Cu
Product Mass (mg) 65.31
Moisture Sensitivity Level (MSL) 3
Recommend Mounting Reflow
Quantity/Reel (pcs) 2000
Taping Direction E4
Non-use Certificate RoHSⅡ
Non-use Certificate REACH
Non-use Certificate Halogen Free

* Refer to the datasheet for the power dissipation of each product.

CSP0606-85

Download (Package dimension, Taping specification, Taping reels dimension, Power dissipation and Land pattern (Foot pattern))

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