Package CSP0606-85
Pin 85
Dimensions (mm) 6.0×6.0
Thickness (mm) 1.07
Pitch (mm) 0.5
Solder Ball (mm)
Plating Sn3Ag0.5Cu
Product Mass (mg) 65.31
Moisture Sensitivity Level (MSL) 3
Recommend Mounting Reflow
Quantity/Reel (pcs) 2000
Taping Direction E4
Non-use Certificate RoHSⅡ
Non-use Certificate REACH
Non-use Certificate Halogen Free

* Refer to the datasheet for the power dissipation of each product.


Download (Package dimension, Taping specification, Taping reels dimension, Power dissipation and Land pattern (Foot pattern))


Category ProductName Datasheet  
Power Management Multi-channel ICs RC5T619 POWER MANAGEMENT SYSTEM DEVICE