USB8-B3

Package USB8-B3
Pin 8
Dimensions (mm) 1.5x1.5
Thickness (mm) 0.75
Pitch (mm) 0.5
Solder Ball (mm)
Plating Cu,Ni,Au
Product Mass (mg) 3.8
Moisture Sensitivity Level (MSL) 1
Recommend Mounting Reflow:OK
Quantity/Reel (pcs) 3000
Taping Direction TE1/TE2
Non-use Certificate RoHSⅡ
Non-use Certificate REACH
Non-use Certificate Halogen Free

* Refer to the datasheet for the power dissipation of each product.

USB8-B3

Related Package

USB8-B6

Download (Package dimension, Taping specification, Taping reels dimension, Power dissipation and Land pattern (Foot pattern))

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