R5541 系列
18mΩ导通阻抗的3A负载开关IC
- 下载数据表
- ECAD 模型: 了解详情
-

概述
The R5541K is a CMOS-based dual supply voltage load switch IC. The R5541K is an ideal switch for supplying the power from the secondary power source such as the output of a step-down DC/DC converter to the load circuit. A built-in Nch. transistor with typically 18 mΩ ON resistance allows the R5541K to provide a low dropout voltage. Reverse current blocking function prevents the reverse current during shutdown mode. Internally, a single IC consists of an internal voltage step-up circuit, a soft-start circuit, a thermal shutdown circuit, a chip enable circuit and a UVLO circuit. The gate voltage of Nch. driver transistor is supplied by a soft-start circuit. The soft-start circuit is supplied by the external power source (VBIAS). Soft-start time is adjustable by connecting an external capacitor. The R5541K is offered in an ultra-small 6-pin DFN(PL)1216-6G package which achieve the smallest possible footprint solution on boards where area is limited.
规格
消费 | |
---|---|
输入电压范围 | 0.6 V to 4.8 V (5.5 V) |
工作温度范围 | -40°C to 85°C (125°C) |
电源电流 | Typ. 25 µA (IOUT = 0 mA) |
待机电流 | Typ. 0.01 µA |
输出电流 | Max. 3 A |
导通电阻 | 18 mΩ (VIN = 1.0 V, VBIAS = 5.0 V) |
内置FET | Nch |
封装 | DFN(PL)1216-6G |
VBIAS Input Voltage Range (Maximum Rating) | 2.5 V to 5.5 V (6.0 V) |
Thermal Shutdown | 145°C |
保护回路/功能
TSD | Reverse | OCP | UVLO | OVLO | Soft Start | PGOOD | Auto Discharge | Reset |
---|---|---|---|---|---|---|---|---|
功能说明
TSD | Thermal Shutdown Function |
---|---|
Reverse Current Protection | Reverse Current Protection |
OCP | Overcurrent Protection |
UVLO | Undervoltage Lockout Protection |
OVLO | Overvoltage Lockout Protection |
Soft Start | Soft Start Function |
PGOOD | Power Good Output |
Auto Discharge | Auto Discharge Circuit |
技术资料
-
Typical Application
-
Switch On Resistance vs. VIN Input Voltage
-
VOUT Output Voltage On Time vs. DELAY Capacitance
品质&封装
产品名称 | 对应 | 封装 | 标注 | 信赖性 |
---|---|---|---|---|
R5541K001x-E2 |
|
DFN(PL)1216-6G | 请参见数据表 | R5541K |
- 有关产品的详细信息,请参见数据表。
- 封装文件或数据表包括封装尺寸,卷带规格,卷带盘尺寸,功耗和建议的焊盘图案。