WLCSP-30-ZA1

Package WLCSP-30-ZA1
Pin 30
Dimensions (mm) 2.32×2.37
Thickness (mm) 0.6
Pitch (mm) 0.48
Solder Ball (mm) 0.22
Plating Sn3.0Ag0.5Cu
Product Mass (mg) 6
Moisture Sensitivity Level (MSL)
Recommend Mounting Reflow
Quantity/Reel (pcs) 3000
Taping Direction E1
Non-use Certificate RoHSⅡ
Non-use Certificate REACH
Non-use Certificate Halogen Free

* Refer to the datasheet for the power dissipation of each product.

WLCSP-30-ZA1

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