SSOP20-F1

Package SSOP20-F1
Pin 20
Dimensions (mm) 4.4x8.9
Thickness (mm) 1.85
Pitch (mm) 0.8
Solder Ball (mm)
Plating Sn2.5Ag
Product Mass (mg) 190
Moisture Sensitivity Level (MSL) 1
Recommend Mounting Reflow:OK
Quantity/Reel (pcs) 2000
Taping Direction TE1/TE2
Non-use Certificate RoHSⅡ
Non-use Certificate REACH
Non-use Certificate Halogen Free

* Refer to the datasheet for the power dissipation of each product.

SSOP20-F1

Download (Package dimension, Taping specification, Taping reels dimension, Power dissipation and Land pattern (Foot pattern))

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