EPCSP10-B2

Package EPCSP10-B2
Pin 10
Dimensions (mm) 1.55x1.15
Thickness (mm) 0.55
Pitch (mm) 0.4
Solder Ball (mm)
Plating Cu,Ni,Au
Product Mass (mg) 2
Moisture Sensitivity Level (MSL) 1
Recommend Mounting Reflow:OK
Quantity/Reel (pcs) 3000
Taping Direction TE1/TE2
Non-use Certificate RoHSⅡ
Non-use Certificate REACH
Non-use Certificate Halogen Free

* Refer to the datasheet for the power dissipation of each product.

EPCSP10-B2

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