DFN10-K1(SON10-K1)

Package DFN10-K1(SON10-K1)
Pin 10
Dimensions (mm) 2.8x2.9
Thickness (mm) 0.8
Pitch (mm) 0.5
Solder Ball (mm)
Plating Sn2.5Ag
Product Mass (mg) 16
Moisture Sensitivity Level (MSL) 1
Recommend Mounting Reflow/Flow:OK
Quantity/Reel (pcs) 3000
Taping Direction TE3/TE4
Non-use Certificate RoHSⅡ
Non-use Certificate REACH
Non-use Certificate Halogen Free

* Refer to the datasheet for the power dissipation of each product.

DFN10-K1(SON10-K1)

Related Package

SON-10

Download (Package dimension, Taping specification, Taping reels dimension, Power dissipation and Land pattern (Foot pattern))

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