CSP0608-80

Package CSP0608-80
Pin 80
Dimensions (mm) 8.0×6.0
Thickness (mm) 1.2
Pitch (mm) 0.65
Solder Ball (mm)
Plating Sn3Ag0.5Cu
Product Mass (mg) 150.31
Moisture Sensitivity Level (MSL) 3
Recommend Mounting Reflow
Quantity/Reel (pcs) 2000
Taping Direction E4
Non-use Certificate RoHSⅡ
Non-use Certificate REACH
Non-use Certificate Halogen Free

* Refer to the datasheet for the power dissipation of each product.

CSP0608-80

Download (Package dimension, Taping specification, Taping reels dimension, Power dissipation and Land pattern (Foot pattern))

Products

分类 产品名 产品规格书  
电源管理多频道芯片 RC5T619 POWER MANAGEMENT SYSTEM DEVICE